UCIe Chiplet Interconnect Standard for Universal Interoperability Announced; Backed by Intel, AMD, TSMC

Chip manufactures and cloud service providers have formed a consortium to create a new Universal Chiplet Interconnect Express (UCIe) for universal ‘chiplet’ interoperability. Manufacturers will be able to use different chiplet components to design and develop CPUs and SoCs faster, and allow for different components to be used.

from Gadgets 360 https://ift.tt/83NTdMs